Edge Compute & RF Gateways
Magicstick carrier board architecture, ARM Cortex-A76 integration, LoRaWAN/5G backhaul, and high-gain antenna impedance matching.
SOLUTIONS // DEPIN & IOT NETWORKS
Deploy the Physical Layer of Web3
From custom PCBA schematics to on-chain proof-of-physical-work. We engineer, manufacture, and deploy the hardware that powers Decentralized Physical Infrastructure Networks.
[ Physical Architecture ]//Hardware Specs
Industrial-Grade Edge Hardware & DePIN Gateways.
Optimized for high-interference outdoor environments. Engineered with embedded cryptographic root-of-trust, zero-trust telemetry validation, and modular carrier boards.
Hardware Security Modules (HSM) & Secure Boot
Dedicated TPM 2.0 / ATECC608 secure elements, biometric edge-authentication, and on-chain proof-of-physical-work signing.
Ruggedized DFM & Environmental Hardening
IP67/IP68 industrial enclosures, -40°C to +85°C thermal range, conformal coated PCBA layers, and automated EVT/DVT testing.
Core Hardware Capabilities
Engineering-grade modules for production-ready IoT infrastructure
Custom PCBA & Enclosure Design
Multilayer schematic capture, thermal stress validation, and industrial CAD enclosures built for extreme edge environments.
Edge Computing Gateways
Hardened compute modules optimized for proprietary hardware like the Magicstick, processing data before it hits the chain.
LoRaWAN & 5G Sensor Mesh
High-range, low-power industrial sensor networks for real-time telemetry and environmental data ingestion.
Hardened Firmware Development
Bare-metal C/C++ and memory-safe Rust firmware designed to prevent remote exploits and ensure immutable device identity.
The Proof-of-Physical-Work Pipeline
Hardware-to-Chain Architecture
01
Physical Ingestion
Custom IoT sensors capture verifiable, cryptographically signed real-world data.
→
02
Edge Verification
Local hardware security modules (HSMs) sign the payload, preventing spoofing or tampering.
→
03
On-Chain Oracle
Data is bridged via secure oracles to trigger smart contracts and token rewards.
Rapid EVT/DVT Prototyping
We sprint from breadboard MVPs to fully functional engineering validation test units in weeks.
Global Supply Chain Sourcing
Direct relationships with Shenzhen and global fabricators for resilient BOM sourcing.
Zero-Defect Manufacturing
Strict QA protocols and automated testing rigs ensure your nodes work flawlessly out of the box.
DEPLOYMENT SHOWCASE // GLOBAL LOGISTICS
Cold Chain DePIN Sensor Network
Engineered and manufactured 50,000+ IoT temperature nodes for a global supply chain DePIN. Handled the full stack: PCBA design, Rust firmware, injection-molded enclosures, and the bridging logic to Solana.
50,000+ active nodes deployed globally
Real-time temperature telemetry with sub-second latency
Solana-native proof-of-work consensus
⚡
Global Sensor Network Visualization
50K+ active nodes across 127 countries
Technology Stack
Rust
C/C++
Altium Designer
SolidWorks
Solana
LoRaWAN
Helium Network
IPFS
Rust
C/C++
Altium Designer
SolidWorks
Solana
LoRaWAN
Helium Network
IPFS
Engineered for Byzantine Environments
Enterprise-grade security protocols built to withstand adversarial conditions
Hardware Security Modules (HSM)
Cryptographic Boot Sequences
Anti-Tamper Enclosure Switches
Over-The-Air (OTA) Encrypted Updates
Finalize Your Node Architecture
Hardware mistakes are permanent. Engage our Engineering Lab for a $7,500 Design for Manufacturing (DFM) Audit before you commit to a mass production run.
Includes PCBA validation, thermal analysis, supply chain risk assessment, and firmware security review.